Package Outline Drawing
HCPL-354-000E
2.54
±
0.25
3.60
±
0.3
5.30
±
0.3
354
LEAD
FREE
DATE CODE
4.40
±
0.2
2.00
±
0.2
Y WW
0.40
±
0.1
RANK
0.10
±
0.1
7.00
+ 0.2
– 0.7
DIMENSIONS IN MILLIMETERS.
HCPL-354-060E
2.54
±
0.25
3.60
±
0.3
5.30
±
0.3
354 V
LEAD
FREE
DATE CODE
4.40
±
0.2
2.00
±
0.2
Y WW
0.40
±
0.1
RANK
0.10
±
0.1
+ 0.2
7.00 – 0.7
DIMENSIONS IN MILLIMETERS.
Solder Reflow Temperature Profile
Temperature (
°
C)
30 seconds
250
°
C
217
°
C
200
°
C
260
°
C (Peak Temperature)
1) One-time soldering reflow is rec-
ommended within the condition
of temperature and time profile
shown at right.
2) When using another soldering
method such as infrared ray lamp,
the temperature may rise partially
in the mold of the device. Keep the
temperature on the package of the
device within the condition of (1)
above.
150
°
C
60 sec
25
°
C
60 ~ 150 sec
90 sec
Time (sec)
60 sec
Note: Non-halide flux should be used.
3
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
