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HCPL-J314 参数 Datasheet PDF下载

HCPL-J314图片预览
型号: HCPL-J314
PDF下载: 下载PDF文件 查看货源
内容描述: 0.6安培输出电流IGBT栅极驱动光电耦合器 [0.6 Amp Output Current IGBT Gate Drive Optocoupler]
分类和应用: 栅极光电双极性晶体管栅极驱动
文件页数/大小: 16 页 / 311 K
品牌: AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
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HCPL-J314
0.6 Amp Output Current IGBT Gate Drive Optocoupler
Data Sheet
Lead (Pb) Free
RoHS 6 fully
compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
Description
The HCPL-J314 family of devices consists of an AlGaAs LED
optically coupled to an integrated circuit with a power
output stage. These optocouplers are ideally suited for
driving power IGBTs and MOSFETs used in motor control
inverter applications. The high operating voltage range
of the output stage provides the drive voltages required
by gate controlled devices. The voltage and current
supplied by this optocoupler makes it ideally suited for
directly driving small or medium power IGBTs. For IGBTs
with higher ratings the HCPL-3150 (0.6 A) or HCPL-3120
(2.5 A) optocouplers can be used.
Features
• 0.6 A maximum peak output current
• 0.4 A minimum peak output current
• High speed response:
0.7 µs max. propagation delay over temperature
range
• Ultra high CMR: min. 25 kV/µs at V
CM
= 1.5 kV
• Bootstrappable supply current: max. 3 mA
• Wide operating temperature range: -40°C to 100°C
• Wide V
CC
operating range: 10 V to 30 V over tempera-
ture range
• Available in DIP8 (single) and SO16 (dual) package
• Safety approvals: UL Recognized, 3750 Vrms for 1
minute. CSA Approval IEC/EN/DIN EN 60747-5-2 Ap-
proval. V
IORM
= 891 V
peak
Functional Diagram
N/C
ANODE
CATHODE
N/C
1
2
3
4
8
7
6
5
V
CC
V
O
V
O
V
EE
Applications
Isolated IGBT/Power MOSFET gate drive
AC and brushless DC motor drives
Inverters for appliances
Industrial inverters
Switch Mode Power Supplies (SMPS)
Uninterruptable Power Supplies (UPS)
SHIELD
HCPL-J314
Truth Table
LED
OFF
ON
V
O
LOW
HIGH
A 0.1 µF bypass capacitor must be
connected between pins V
CC
and V
EE
.
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.