HDJD-J822
Color Management System Feedback Controller
Data Sheet
Description
The following cumulative test results have been ob-
tained from testing performed at Avago Technologies
in accordance with the latest revision of JEDEC. Avago
Technologies tests parts at the absolute maximum rated
conditions recommended for the device. The actual per-
formance you obtain from Avago Technologies parts de-
pends on the electrical and environmental characteristics
of your application but will probably be better than the
performance outlined in Table 1.
Failure Rate Prediction
The junction temperature of the device determines the
failure rate of semiconductor devices. The relationship
between ambient temperature and actual junction tem-
perature is given by the following:
T
J
(°C) = T
A
(°C) +
θ
JA
P
AVG
where:
T
A
= ambient temperature in °C
θ
JA
= thermal resistance of junction-to-ambient in °C/
Watt
P
AVG
= average power dissipated in Watt
The estimated MTBF and failure rate at temperatures low-
er than the actual stress temperature can be determined
by using an Arrhenius model for temperature accelera-
tion. Results of such calculations are shown in the table
below using activation energy of 0.7eV.
Table 1. Life Tests
Demonstrated Performance
Performance in Time
(60% confidence)
MTBF
[1]
2.52 x 10
5
Failure Rate
[2]
(FIT)
3968
Test Name
High Temperature
Operating Life
Stress Test
Conditions
T
A
= 85°C,
AVdd = 5.5V,
DVdd = 5.5V
Total
Device Hrs
231,000
Units
Tested
231
Units
Failed
0
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
