HEDS-5500, HEDS-6500 and HEDS-9000, 9100, 9200 Series
Motion Sensing Products, Optical Encoder Modules
Reliability Data
Description
The following cumulative test results have been obtained
from testing performed at Avago Technologies in accord-
ance with the latest revision of MIL- STD-883.
Avago tests parts at the absolute maximum rated con-
ditions recommended for the device. The actual per-
formance you obtain from Avago parts depends on the
electrical and environmental characteristics of your ap-
plication but will probably be better than the perform-
ance outlined in Table .
Failure Rate Prediction
The failure rate of semiconductor devices is determined
by the junction temperature of the device. The relation-
ship between ambient temperature and actual junction
temperature is given by the following:
T
J
(°C) = T
A
(°C) +
θ
JA
P
AVG
where
T
A
= ambient temperature in °C
θ
JA
= thermal resistance of
junction-to-ambient in °C/watt
P
AVG
= average power dissipated in watts
The estimated MTBF and failure rate at temperatures
lower than the actual stress temperature can be deter-
mined by using an Arrhenius model for temperature ac-
celeration. Results of such calculations are shown in the
table on the following page using an activation energy of
0.43 eV (reference MIL-HDBK-27).
Table 1. Life Tests
Demonstrated Performance
Point Typical Performance
Test Name
High Temperature
Operating Life
Stress Test
Conditions
V
CC
= 5.5 V,
V
A
= V
B
= 3.5 V
T
A
= 00°C
000 hours
V
CC
= 5.5 V
V
A
= V
B
= 3.5 V
,000 hours
T
A
= 85°C
RH = 85%
Total
Device Hrs.
,405,000
Units
Tested
,405
Total
Failed
2
MTBF
702,500
Failure Rate
(% /1K Hours)
0.42
Temperature
Humidity
Operating Life
,495,000
,495
0
49,500
0.669
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
