Absolute Maximum Ratings
AlGaAs Red
HLCP-X100
Series
37 mW
[1]
45 mA
[4]
15 mA
15 mA
[1]
5V
–20°C to +100°C
[7]
HER
HLMP-2300/
2600/29XX
Series
135 mW
[2]
90 mA
[5]
25 mA
30 mA
[2]
Yellow
HLMP-2400/
2700/2950
Series
85 mW
[3]
60 mA
[5]
20 mA
25 mA
[3]
6 V
[6]
–40°C to +85°C
–40°C to +85°C
250°C for 3 seconds
–20°C to +85°C
Green
HLMP-2500/
2800/2965
Series
135 mW
[2]
90 mA
[5]
25 mA
30 mA
[2]
Parameter
Average Power Dissipated per LED Chip
Peak Forward Current per LED Chip
Average Forward Current per LED Chip
DC Forward Current per LED Chip
Reverse Voltage per LED Chip
Operating Temperature Range
Storage Temperature Range
Wave Soldering Temperature
1.6 mm (1/16 inch) below Body
Notes:
1. Derate above 87°C at 1.7 mW/°C per LED chip. For DC operation, derate above 91°C at 0.8 mA/°C.
2. Derate above 25°C at 1.8 mW/°C per LED chip. For DC operation, derate above 50°C at 0.5 mA/°C.
3. Derate above 50°C at 1.8 mW/°C per LED chip. For DC operation, derate above 60°C at 0.5 mA/°C.
4. See Figure 1 to establish pulsed operation. Maximum pulse width is 1.5 mS.
5. See Figure 6 to establish pulsed operation. Maximum pulse width is 2 mS.
6. Does not apply to bicolor parts.
7. For operation below –20°C, contact your local Avago sales representative.
Electrical/Optical Characteristics at T
A
= 25°C
AlGaAs Red HLCP-X100 Series
Parameter
Luminous Intensity
per Lighting Emitting
Area
[1]
Peak Wavelength
Dominant Wavelength
[2]
Forward Voltage per LED
Reverse Breakdown Voltage per LED
Thermal Resistance LED Junction-to-Pin
HLCP-
A100/D100/E100
B100/C100/F100/G100
H100
λ
PEAK
λ
d
V
F
V
R
Rθ
J-PIN
5
Symbol
I
V
Min.
3
6
12
Typ.
7.5
15
30
645
637
1.8
15
250
2.2
Max.
Units
mcd
mcd
mcd
nm
nm
V
V
°C/W/
LED
I
F
= 20 mA
I
R
= 100
µA
Test Conditions
I
F
= 3 mA
6
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
