Baking Conditions
HSDL-3005 Moisture Proof
Packaging
All HSDL-3005 options are
shipped in moisture proof
package. Once opened, moisture
absorption begins.
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
Package
Temp.
Time
In reels
60ºC
≥ 48 hours
This part is compliant to JEDEC
Level 4.
In bulk
100ºC
125ºC
150ºC
≥ 4 hours
≥ 2 hours
≥ 1 hour
UNITS IN A SEALED
MOISTURE-PROOF
PACKAGE
Baking should only be done once.
Recommended Storage
Conditions
PACKAGE IS
OPENED (UNSEALED)
Storage Temperature 10ºC to 30ºC
Relative Humidity
below 60% RH
Time from Unsealing to
Soldering
After removal from the bag, the
parts should be soldered within
three days if stored at the recom-
mended storage conditions.
ENVIRONMENT
LESS THAN 25°C,
AND LESS THAN
60% RH
YES
PACKAGE IS
OPENED LESS
THAN 72 HOURS
NO BAKING
IS NECESSARY
YES
NO
PERFORM RECOMMENDED
BAKING CONDITIONS
NO
Figure 7. Baking conditions chart.
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AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
