X
X
2.60
(0.103)
0.40 (0.016)
1.10
(0.043)
Y
Y
0.50
(0.020)
4.50 (0.178)
1.50 (0.059)
REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
DIMENSIONS IN mm (INCHES).
SOLDER RESIST
Figure 8a. Recommended Soldering Pad Pattern.
X
X
0.5 (0.020)
6.1 (0.240)
2.8 (0.110)
Y
2.0 (0.079)
2.0 (0.079)
6.0 (0.236)
1.0 (0.039)
Y
3.0 (0.118)
DIMENSIONS IN mm (INCHES).
REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
ThermalResistance
300°C/W
Solder Pad Area (xy)
>16 mm2
350°C/W
>12 mm2
470°C/W
>8 mm2
10 to 20 SEC.
Figure 8b. Recommended Soldering Pad Pattern (TTW).
+5 °C
-0 °C
255 °C
217 °C
3 °C/SEC. MAX.
125 °C ± 25 °C
6 °C/SEC. MAX.
20 SEC. MAX.
240°C MAX.
3°C/SEC. MAX.
100-150°C
183°C
MAX. 120 SEC.
60 to 150 SEC.
–6°C/SEC.
MAX.
3°C/SEC.
MAX.
TIME
120 SEC. MAX. 60-150 SEC.
TIME
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 9a. Recommended SnPb Reflow Soldering Profile.
Figure 9b. Recommended Pb-free Reflow Soldering Profile.
Note: For detailed information on reflow soldering of Avago surface
mount LEDs, refer to Avago Application Note AN 1060 Surface
Mounting SMT LED Indicator Components.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
200
150
100
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
FLUXING
PREHEAT
SOLDER: SN63; FLUX: RMA
50
30
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
0
10 20 30 40 50 60 70 80 90 100
TIME – SECONDS
Figure 10. Recommended Wave Soldering Profile.
6
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
