X
2.60
(0.103)
1.10
(0.043)
X
0.40 (0.016)
0.50
(0.020)
4.50 (0.178)
Y
1.50 (0.059)
Y
DIMENSIONS IN mm (INCHES).
SOLDER RESIST
REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
Figure 8a. Recommended Soldering Pad Pattern.
6.1 (0.240)
2.8 (0.110)
X
X
0.5 (0.020)
Y
2.0 (0.079)
6.0 (0.236)
2.0 (0.079)
3.0 (0.118)
Y
1.0 (0.039)
DIMENSIONS IN mm (INCHES).
REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
Thermal Resistance
300°C/W
350°C/W
470°C/W
Solder Pad Area (xy)
>16 mm
2
>12 mm
2
>8 mm
2
10 to 20 SEC.
+5 °C
255 °C
-0 °C
6 °C/SEC. MAX.
Figure 8b. Recommended Soldering Pad Pattern (TTW).
217 °C
TEMPERATURE
3 °C/SEC. MAX.
125 °C ± 25 °C
20 SEC. MAX.
TEMPERATURE
240°C MAX.
3°C/SEC. MAX.
100-150°C
3°C/SEC.
MAX.
120 SEC. MAX. 60-150 SEC.
TIME
183°C
–6°C/SEC.
MAX.
MAX. 120 SEC.
60 to 150 SEC.
TIME
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 9a. Recommended SnPb Reflow Soldering Profile.
TURBULENT WAVE
250
TEMPERATURE –
°C
LAMINAR WAVE
HOT AIR KNIFE
BOTTOM SIDE
OF PC BOARD
Figure 9b. Recommended Pb-free Reflow Soldering Profile.
Note:
For detailed information on reflow soldering of Avago surface
mount LEDs, refer to Avago Application Note AN 1060
Surface
Mounting SMT LED Indicator Components.
200
150
FLUXING
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
100
50
30
0
10
PREHEAT
20
30
40
50
60
70
80
90
100
TIME – SECONDS
Figure 10. Recommended Wave Soldering Profile.
6
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
