100
RELATIVE INTENSITY – %
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0
ANGLE
10 20 30 40 50 60 70 80 90
Figure 6. Relative intensity vs. angle for HSMx-C177/197.
100
RELATIVE INTENSITY – %
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0
ANGLE
10 20 30 40 50 60 70 80 90
Figure 7. Relative intensity vs. angle for HSMx-C265.
10 SEC. MAX.
255 - 260 C
3 C/SEC. MAX.
6 C/SEC. MAX.
3 C/SEC. MAX.
60 - 120 SEC.
60 SEC. MAX.
TEMPERATURE
10 SEC. MAX.
230°C MAX.
TEMPERATURE
217 C
200 C
150 C
140-160°C
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
4°C/SEC. MAX.
3°C/SEC. MAX.
TIME
Figure 8. Recommended reflow soldering profile.
CENTERING
BOARD
Figure 9. Recommended Pb-free reflow soldering profile.
CENTERING
BOARD
0.8 (0.031
1.2 (0.047
1.2
(0.047)
1.2
(0.047)
0.8
(0.031)
0.9
(0.035)
0.7
(0.028)
0.8
(0.031)
Figure 10. Recommended soldering
pattern for HSMx-C177.
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
Figure 11. Recommended soldering
pattern for HSMx-C197.
7
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
