HSMF-C16x
Data Sheet
Miniature Bi-Color Surface Mount ChipLEDs
Description
This series of bi-color ChipLEDs is designed with the small-
est footprint to achieve high density of components on
board. They have the industry standard footprint of 1.6
mm x 0.8 mm and a height of only 0.5 mm. This makes
them very suitable for cellular phone and mobile equip-
ment backlighting and indication. They are available in
a wide range of color combinations. In order to facilitate
automated pick and place operation, these ChipLEDs are
shipped in tape and reel, with 4000 units per reel. These
parts are compatible with reflow soldering.
Features
•
Small size
•
0603 industry standard footprint
•
Diffused optics
•
Operating temperature range of –30˚C to +85˚C
•
Compatible with reflow soldering
•
Available in various color combination
•
Available in 8 mm tape on 7" (178 mm) diameter
reels
Applications
•
Keypad backlighting
•
Symbol indicator
•
LCD backlighting
•
Pushbutton backlighting
•
Front panel indicator
Device Selection Guide
Part Number
HSMF-C162
HSMF-C163
HSMF-C164
HSMF-C165
HSMF-C166
HSMF-C167
HSMF-C168
HSMF-C169
Color
AlInGaP Red / AlInGaP Amber
AlInGaP Red / InGaN Green
AlInGaP Red / InGaN Blue
High Efficiency Red / GaP Green
GaP Yellow / GaP Green
GaP Orange / GaP Green
InGaN Green / InGaN Blue
AlInGaP Amber / InGaN Blue
Package Description
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
CAUTION:
HSMF-C16x LEDs are class 1A ESD sensitive per JESD22-A114C.01 standard. Please observe appropriate pre-
cautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
