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HSMF-C156 参数 Datasheet PDF下载

HSMF-C156图片预览
型号: HSMF-C156
PDF下载: 下载PDF文件 查看货源
内容描述: 双色表面贴装芯片LED [Bi-color Surface Mount Chip LEDs]
分类和应用: 光电
文件页数/大小: 8 页 / 212 K
品牌: AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
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100
I
F
- FORWARD CURRENT - mA
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
I
F MAX.
- MAXIMUM FORWARD CURRENT - mA
1.6
35
30
25
20
15
10
5
0
0
20
40
60
80
100
J-A
= 600°C/W
J-A
= 800°C/W
10
HER
GREEN
1.2
0.8
1
YELLOW
0.1
ORANGE
1.5
1.7
1.9
2.1
2.3
V
F
- FORWARD VOLTAGE - V
0.4
0
0
10
20
30
40
I
F
- FORWARD CURRENT - mA
T
A
- AMBIENT TEMPERATURE -
°C
Figure 2. Forward current vs. forward voltage.
Figure 3. Luminous intensity vs. forward
current (all colors).
Figure 4. Maximum forward current vs. ambient
temperature.
1.00
0.90
RELATIVE INTENSITY - %
0.80
0.70
0.60
TEMPERATURE
10 SEC. MAX.
230 MAX.
°C
140-160°C
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
4°C/SEC. MAX.
3°C/SEC. MAX.
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 5. Relative intensity vs. angle for HSMF-C153, C155, C156, C157 and C158.
Figure 6. Recommended reflow soldering profile.
10 - 30 SEC.
TEMPERATURE
217°C
200°C
150°C
255 - 260 °C
3 °C/SEC. MAX.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
60 - 120 SEC.
TIME
100 SEC. MAX.
1.0 (0.039)
0.4 (0.016)
1.0 (0.039)
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
(Acc. to J-STD-020C)
Note: 1. All dimensions in millimeters (inches).
Figure 8. Recommended solder pad pattern.
Figure 7. Recommended Pb free reflow soldering profile.