0.5
DELTA V
F
(NORMALIZED AT 25°C)
0.4
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
-100
-50
InGaN/GaN
0
50
100
150
GaP/AlGaAs/
AlInGaP
TEMPERATURE – °C
Figure 6. Forward voltage shift vs. temperature.
Figure 7. Radiation Pattern.
10 to 30 SEC.
TEMPERATURE
217
°C
200
°C
150
°C
255 - 260
°C
3
°C/SEC.
MAX.
6
°C/SEC.
MAX.
3
°C/SEC.
MAX.
60 - 120 SEC.
100 SEC. MAX.
TIME
(Acc. to J-STD-020C)
Figure 8a. Recommended SnPb reflow soldering profile.
Note: For detail information on reflow soldering of Avago surface
mount LEDs, do refer to Avago Application Note AN 1060 Surface
Mounting SMT LED Indicator Components.
Figure 8b. Recommended Pb-free reflow soldering profile.
4.50
1.50
TURBULENT WAVE
250
TEMPERATURE –
°C
LAMINAR WAVE
HOT AIR KNIFE
2.60
200
150
FLUXING
100
50
30
0
10
BOTTOM SIDE
OF PC BOARD
PREHEAT
TOP SIDE OF
PC BOARD
20
30
40
50
60
70
80
90
100
TIME – SECONDS
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
LEADED SOLDER: SN63; FLUX: RMA
LEAD-FREE SOLDER: 96.5 wt% SN, 3 wt% Ag, 0.5 wt% Cu
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
SOLDER RESIST
Figure 9. Recommended wave soldering profile.
Figure 10. Recommended soldering pad pattern.
9
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
