10 - 30 SEC.
255 - 260
°C
3
°C/SEC.
MAX.
6
°C/SEC.
MAX.
3
°C/SEC.
MAX.
60 - 120 SEC.
100 SEC. MAX.
TEMPERATURE
10 SEC. MAX.
TEMPERATURE
217
°C
200
°C
150
°C
230°C MAX.
140-160°C
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
4°C/SEC. MAX.
–3°C/SEC.
TIME
(Acc. to J-STD-020C)
Figure 7. Recommended reflow soldering profile.
Figure 8. Recommended Pb-free reflow soldering profile.
5.0 (0.200)
0.9 (0.035)
0.9 (0.035)
1.0 (0.039)
0.2 (0.008)
CENTERING
BOARD
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
1.2 (0.047)
1.2
(0.047)
1.2
(0.047)
0.9
(0.035)
Figure 9. Recommended soldering pattern for HSMx-C110.
Figure 10. Recommended soldering pattern for HSMx-C170.
0.8 (0.031)
1.5 (0.059)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
Figure 11. Recommended soldering pattern for HSMx-C190 and C191.
Figure 12. Recommended soldering pattern for HSMx-C150.
Note: All dimensions in millimeters (inches).
8