0.5
0.4
0.ꢀ
0.ꢁ
0.ꢂ
0
GaP/AlGaAs/
AlInGaP
-0.ꢂ
-0.ꢁ
-0.ꢀ
InGaN/GaN
50
TEMPERATURE – °C
-ꢂ00
-50
0
ꢂ00
ꢂ50
Figure 6. Forward voltage shift vs. temperature.
Figure 7. Radiation Pattern.
ꢂ0 to ꢀ0 SEC.
ꢁ55 - ꢁ60 °C
ꢀ °C/SEC. MAX.
ꢁꢂ7 °C
ꢁ00 °C
6 °C/SEC. MAX.
ꢂ50 °C
ꢀ °C/SEC. MAX.
ꢂ00 SEC. MAX.
60 - ꢂꢁ0 SEC.
TIME
(Acc. to J-STD-0ꢁ0C)
Figure 8a. Recommended SnPb reflow soldering profile.
Figure 8b. Recommended Pb-free reflow soldering profile.
Note: For detail information on reflow soldering of Avago surface
mount LEDs, do refer to Avago Application Note AN 1060 Surface
Mounting SMT LED Indicator Components.
4.50
ꢂ.50
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
ꢁ.60
ꢁ50
ꢁ00
ꢂ50
ꢂ00
FLUXING
PREHEAT
BOTTOM SIDE
OF PC BOARD
50
ꢀ0
TOP SIDE OF
PC BOARD
0
ꢂ0 ꢁ0 ꢀ0 40 50 60 70 80 90 ꢂ00
TIME – SECONDS
CONVEYOR SPEED = ꢂ.8ꢀ M/MIN (6 FT/MIN)
PREHEAT SETTING = ꢂ50°C (ꢂ00°C PCB)
SOLDER WAVE TEMPERATURE = ꢁ45°C
AIR KNIFE AIR TEMPERATURE = ꢀ90°C
AIR KNIFE DISTANCE = ꢂ.9ꢂ mm (0.ꢁ5 IN.)
AIR KNIFE ANGLE = 40°
LEADED SOLDER: SN6ꢀ; FLUX: RMA
LEAD-FREE SOLDER: 96.5 wt% SN, ꢀ wt% Ag, 0.5 wt% Cu
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
SOLDER RESIST
Figure 9. Recommended wave soldering profile.
Figure 10. Recommended soldering pad pattern.
9
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
