MGA-425P8
GaAs Enchancement-mode PHEMT
Power Amplifier in 2x2 mm
2
LPCC Package
Data Sheet
Description
Avago Technologies’s MGA-425P8 power amplifier is designed
for wireless application in the 2–10 GHz frequency range. The
PA has a high power efficiency (PAE) achieved through the
use of Avago Technologies’s proprietary GaAs Enhancement-
mode pHEMT process.
MGA-425P8 is housed in a miniature 2.0 x 2.0 x 0.75 mm 8-lead
leadless-plastic-chip-carrier (LPCC) package. The compact foot-
print, low profile couple with the excellent thermal efficiency
of the LPCC package makes the MGA-425P8 an ideal choice as
power amplifier that saves board space.
On-chip bias circuitry allows operation from a single +3.3V
power supply. The output of the amplifier is near to 50Ω (be-
low 2:1 VSWR) around 4.9–5.8 GHz. This makes MGA-425P8 an
ideal choice as power amplifier for broadband IEEE 802.11a
system as well as other high performance wireless application
in the 2–10 GHz frequency range.
One external resistor (RBias) is used to set the bias current of
the device over a wide range.
This allows the designer to use the same part in several circuit
positions and tailor the output power/linearity performance,
and current consumption, to suit each position.
Features
• Near 50Ω broadband output match
• Single +3.3V supply
• High Gain & OIP3
• Miniature 2 x 2 x 0.75 mm
LPCC package
• Pb-free & MSL-1 package
• Tape-and-Reel packaging
option available
Specifications
at 5.25 GHz, 3.3V, 58 mA (typ)
• 13.3 dBm Linear Pout @ 5% EVM
• 10.3% PAE @ +13.3 dBm Pout
• 12 dBm Linear Pout @ 3% EVM
• 7.6% PAE @ + 12 dBm Pout
• 47% PAE @ P1dB
• 20.3 dBm P1dB
• 32.9 dBm OIP3
• 16 dB Gain
• 1.7 dB NF
Attention:
Observe precautions for
handling electrostatic
sensitive devices.
ESD Machine Model (Class A)
ESD Human Body Model (Class 1A)
Refer to Agilent Application Note A004R:
Electro-
static Discharge Damage and Control.
Pin Connections and Package Marking
2.0 x 2.0 x 0.75 mm 8-lead LPCC
Pin 1 (NC)
Pin 2 (RFin)
Pin 3 (NC)
Pin 4 (NC)
Pin 8 (NC)
2YX
Top View
Pin 7 (RFout, VD)
Pin 6 (NC)
Pin 5 (RBias)
Note:
Package marking provides orientation and identification
“2Y” = Device Code
“X” = Data code indicates the month of manufacture.
Pin 1 (NC)
Pin 2 (RFin)
Pin 3 (NC)
Pin 4 (NC)
Pin 8 (NC)
Pin 7 (RFout, VD)
Simplified Schematic
Vd
I
bias
R
bias
V
bias
5
2
Bias
Id
=
I
ds +
I
bias
I
ds
GND
Pin 6 (NC)
Pin 5 (RBias)
7
Bottom View
Note:
Use Die Attach Padded for electrical grounding and thermal dissipa-
tion
1, 3, 4, 6, 8