Accu-Guard® II
SMD Thin-Film Fuse
ENVIRONMENTAL CHARACTERISTICS
Test
Solderability
Conditions
Requirement
Terminations to be well tinned
No visible damage
Dissolution of termination
≤ 25% of area
Components completely immersed in a
solder bath at 235 5°C for 2 secs.
Completely immersed in a solder bath
at 260 5°C for 60 secs.
Leach Resistance
∆R/R<10%
Storage
Shear
12 months minimum with components
stored in “as received” packaging.
Components mounted to a substrate.
A force of 5N applied normal to the
line joining the terminations and in
a line parallel to the substrate.
Components mounted to a substrate.
50 cycles -55°C to +125°C.
Per Mil-Std-202F
Good solderability
No visible damage
Rapid Change of
Temperature
Vibration
No visible damage
∆ R/R<10%
No visible damage
∆R/R<10%
Method 201A and
Method 204D Condition D.
Bend
Tested as shown in diagram
No visible damage
∆R/R<10%
3 mm
Deflection
45mm
45mm
Load Life
25°C, rated current, 20,000 hrs.
No visible damage
F0805B, F1206B
∆R/R<10%
8
KYOCERA AVX [ KYOCERA AVX ]
