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TAZH686K004LBSC0H00 参数 Datasheet PDF下载

TAZH686K004LBSC0H00图片预览
型号: TAZH686K004LBSC0H00
PDF下载: 下载PDF文件 查看货源
内容描述: TAZ系列 [TAZ Series]
分类和应用:
文件页数/大小: 15 页 / 351 K
品牌: AVX [ AVX CORPORATION ]
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TAZ Series
CWR09 - MIL-PRF-55365/4
Established Reliability, COTS-Plus & Space Level
profile construction, with the A case being
the world’s smallest molded military
tantalum chip.
All 4V to 50V ratings are qualified to
MIL-PRF-55365 Weibull “B”, “C”, “D” and
“T” levels, with all surge options (“A”, “B” &
“C”) available.
For Space Level applications, AVX SRC
9000 qualification is recommended (see
ratings table for part number availability).
There are four termination finishes available:
solder plated, fused solder plated, hot solder
dipped and gold plated (these are “H”, “K”,
“C” and “B” termination, respectively, per
MIL-PRF-55365). In addition, the molding
compound has been selected to meet the
requirements
of
UL94V-0
(Flame
Retardancy) and outgassing requirements of
NASA SP-R-0022A.
millimeters (inches)
Term. Width (W
1
)
1.27±0.13
(0.050±0.005)
1.27±0.13
(0.050±0.005)
1.27±0.13
(0.050±0.005)
2.41+0.13/-0.25
(0.095+0.005/-0.010)
2.41+0.13/-0.25
(0.095+0.005/-0.010)
3.30±0.13
(0.130±0.005)
2.67±0.13
(0.105±0.005)
3.68+0.13/-0.51
(0.145+0.005/-0.020)
1.0±0.10
(0.039±0.004)
Term. Length (A)
+0.25/-0.13
(+0.010/-0.005)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
1.27 (0.050)
1.27 (0.050)
0.50 (0.020)
+0.30 (0.012)
-0.20 (0.008)
S min
0.38
(0.015)
1.65
(0.065)
2.92
(0.115)
1.65
(0.065)
2.92
(0.115)
3.43
(0.135)
3.56
(0.140)
4.06
(0.160)
0.71
(0.028)
Typical
Weight (g)
0.016
0.025
0.035
0.045
0.065
0.125
0.205
0.335
0.010
This is the original high reliability molded
tantalum chip series and the case sizes still
represent the most flexible of surface mount
form factors. TAZ offers nine case sizes,
eight of which (A through H) are fully qualified
to MIL-PRF-55365/4, and also includes the
original sub-miniature R case (non-QPL).
This series is fully interchangeable with
CWR06 conformal types, while offering the
advantages of molded body / compliant
termination construction (ensuring no TCE
mismatch with any substrate). This
construction is compatible with a wide range
of SMT board assembly processes including
wave or reflow solder, conductive epoxy or
compression bonding techniques.
The parts also carry full polarity and
capacitance / voltage marking. The five
smaller cases are characterized by their low
CASE DIMENSIONS:
Case
Length (L)
Width (W)
Height (H)
Code ±0.38 (0.015) ±0.38 (0.015) ±0.38 (0.015)
A
2.54 (0.100)
3.81 (0.150)
5.08 (0.200)
3.81 (0.150)
5.08 (0.200)
5.59 (0.220)
6.73 (0.265)
7.24 (0.285)
1.27 (0.050)
1.27 (0.050)
1.27 (0.050)
2.54 (0.100)
2.54 (0.100)
3.43 (0.135)
2.79 (0.110)
3.81 (0.150)
1.27 (0.050)
1.27 (0.050)
1.27 (0.050)
1.27 (0.050)
1.27 (0.050)
1.78 (0.070)
2.79 (0.110)
2.79 (0.110)
1.20 (0.047)
max
MARKING
(White marking on black body)
Polarity Stripe (+)
Capacitance Code
Rated Voltage
B
C
D
E
F
G
H
R
CWR09 MIL-PRF-55365/4
Capacitance
μF
Code
0.10
104
0.15
154
0.22
224
0.33
334
0.47
474
0.68
684
1.0
105
1.5
155
2.2
225
3.3
335
4.7
475
6.8
685
10
106
15
156
22
226
33
336
47
476
68
686
100
107
150
157
220
227
1.30 (0.051)
2.05 (0.081) +0.20 (0.008)
±0.20 (0.008) -0.10 (0.004)
CAPACITANCE AND RATED VOLTAGE, V
R
(VOLTAGE CODE) RANGE (LETTER DENOTES CASE SIZE)
4V (C)
6V (D)
10V (F)
Rated Voltage DC (V
R
) at 85ºC
15V (H)
20V (J)
25V (K)
35V (M)
50V (N)
A
A
B
B
C
D
E
F
F
G
H
A
R
R
R
A
A/R
A
A/R
B
C
D
E
F
G
H
G
H
B
C
D
E
F
G
H
B
C
D
E
F
G
H
B
C
D
E
F
G
H
A
A
B
B
C
D
E
F
B
C
D
E
F
G
G
H
B
C
D
E
F
G
H
JUNE 2013
7