BD09B
Dedicated Band 2-Way SMT Power Divider
700~1000MHz Cellular & GSM900
Device Features
Typical Isolation = 23 dB
Typical Insertion Loss = 0.5 dB
MSL 1 moisture rating
Lead-free/RoHS-compliant SOIC-8 Plastic Package
With exposed back side ground pad
Typical Performance
1
Parameter
Frequency Range
Insertion Loss
Isolation
IRL(S11)
ORL(S22/S33)
Amplitude Balance
Phase Balance
Min
700
0.5
15
23
-20
-23
0.05
0.2
-15
-15
0.2
0.5
Typical
Max
1000
0.8
Unit
MHz
dB
dB
dBm
dBm
dB
deg
Product Description
BeRex’s Divider BD09B is designed for Cellu-
lar & GSM band with low Insertion Loss and
Isolation. This chip is fully passivated for en-
hanced performance and reliability and
packaged in RoHS-compliant with SOIC-8
surface mount package.
It can be used without back side ground sol-
dering. (This may degrade the performance
at the high frequency edge.)
*All specifications apply to the following test conditions,
1. Device performance _ measured on BeRex E/B at 25
°C, 50ohm system.
2. Insertion Loss: Above 3.0dB.
3. Back side ground _ soldered.
Applications
Base station Infrastructure
Commercial/Industrial/Military wireless system
Absolute Maximum Ratings
Parameter
Input Power
Storage Temperature
Operating Temperature
Rating
1W CW dBm
-55 to +155°C
-40 to +85°C
Operation of this device above any of these parameters may result in permanent damage.
Evaluation Board Drawing
Function Block Diagram
Pins 1,3,4,6 and 7 must be DC and RF grounded.
BeRex
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1
Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex.
All other trademarks are the property of their respective owners. © 2010 BeRex
Rev. C
BEREX [ BEREX CORPORATION ]
