BD1926
Dual Band 2‐Way SMT Power Divider
1700~2300MHz PCS, WCDMA & TD‐SCDMA
Device Features
Typical Isola on = 24.5 dB
Typical Inser on Loss = 0.6 dB
MSL 1 moisture ra ng
Small Size and Low Profile
Lead‐free/RoHS‐compliant SOT‐26 Plas c Package
BD19XX(XX=Wafer number)
Product Descrip on
BeRex’s Divider BD1926 is designed for PCS,
WCDMA & TD‐SCDMA band with low Inser‐
on Loss and Isola on. This chip is fully pas‐
sivated for enhanced performance and relia‐
bility and packaged in RoHS‐compliant with
SOT‐26 surface mount package.
Typical Performance
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Parameter
Frequency Range
Inser on Loss
Isola on
IRL(S11)
ORL(S22/S33)
Amplitude Balance
Phase Balance
Min
1700
16.5
Typical
0.6
24.5
‐16.0
‐24.0
0.07
1.5
Max
2300
0.8
‐11.5
‐19.5
0.2
2.0
Unit
MHz
dB
dB
dBm
dBm
dB
deg
*All specifica ons apply to the following test condi ons,
1. Device performance _ measured on BeRex E/B at 25
°C, 50ohm system.
2. Inser on Loss: Above 3.0dB.
Applica ons
Base sta on Infrastructure
Commercial/Industrial/Military wireless system
Absolute Maximum Ra ngs
Parameter
Input Power
Storage Temperature
Opera ng Temperature
Ra ng
1W CW dBm
‐55 to +155°C
‐40 to +85°C
Opera on of this device above any of these parameters may result in permanent damage.
Evalua on Board Drawing
Func on Block Diagram
Pins 2,4 and 6 must be DC and RF grounded.
BeRex
●website: www.berex.com ●email: sales@berex.com
All other trademarks are the property of their respec ve owners. © 2010 BeRex
1
Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex.
Rev. C
BEREX [ BEREX CORPORATION ]
