BeRex
Triple Band 2-Way SMT Power Divider
1900~2500MHz PCS, WCDMA & TD-SCDMA, WiBro
Device Features and Description
BD23B
25dB Typical Isolation
0.4dB Typical Insertion Loss
Small Size and Low Profile
MSL 1 moisture rating
Lead-free/Green/RoHS compliant package
Application:
commercial, space, military wireless system
Industry Standard SOIC-8 SMT Plastic Package with exposed back side ground pad
Chip is fully passivated for enhanced performance and reliability
Can be used without back side ground soldering
(This may degrade the performance at the high frequency edge. Refer to the following
typical test data)
Electrical specifications
Parameters
Frequency Range
Insertion Loss
Isolation
IRL(S11)
ORL(S22,S33)
Amplitude Balance
Phase Balance
Unit
MHz
dB
dB
dB
dB
dB
deg
Min
1900
Typ
0.4
Max
2500
0.8
15
25
-23
-25
0.05
1.0
-15
-15
0.2
2.0
All specifications apply with the following test conditions,
1. Device performance is measured on BeRex evaluation board at 25C, 50 ohm system
2. Insertion Loss: Above 3.0dB
3. Back side ground was soldered
Absolute Maximum Ratings
Parameters
Input Power
Storage Temperature
Operating Temperature
Rating
1W CW
-55 to +155C
-40C to +85C
Operation of this device above any of these parameters may result in permanent damage.
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BEREX [ BEREX CORPORATION ]
