BD23B
Dual Band 2-Way SMT Power Divider
1900~2500MHz PCS, WCDMA & TD-SCDMA, WiBro
Device Features
Typical Isolation = 25 dB
Typical Insertion Loss = 0.4 dB
MSL 1 moisture rating
Lead-free/RoHS-compliant SOIC-8 Plastic Package
With exposed back side ground pad
Typical Performance
1
Parameter
Frequency Range
Insertion Loss
Isolation
IRL(S11)
ORL(S22/S33)
Amplitude Balance
Phase Balance
Min
1900
0.4
15
25
-23
-25
0.05
0.5
-15
-15
0.2
1.0
Typical
Max
2500
0.8
Unit
MHz
dB
dB
dBm
dBm
dB
deg
Product Description
BeRex’s Divider BD23B is designed for PCS,
WCDMA & TD-SCDMA and WiBro band with
low Insertion Loss and Isolation. This chip is
fully passivated for enhanced performance
and reliability and packaged in RoHS-
compliant with SOIC-8 surface mount pack-
age. It can be used without back side ground
soldering. (This may degrade the perform-
ance at the high frequency edge.)
*All specifications apply to the following test conditions,
1. Device performance _ measured on BeRex E/B at 25
°C, 50ohm system.
2. Insertion Loss: Above 3.0dB.
3. Back side ground _ soldered.
Applications
Base station Infrastructure
Commercial/Industrial/Military wireless system
Absolute Maximum Ratings
Parameter
Input Power
Storage Temperature
Operating Temperature
Rating
1W CW dBm
-55 to +155°C
-40 to +85°C
Operation of this device above any of these parameters may result in permanent damage.
Evaluation Board Drawing
Function Block Diagram
Pins 1,3,4,6 and 7 must be DC and RF grounded.
BeRex
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Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex.
All other trademarks are the property of their respective owners. © 2010 BeRex
Rev. C
BEREX [ BEREX CORPORATION ]
