BL
GALAXY ELECTRICAL
SURFACE MOUNT RECTIFIER
FEATURES
Plastic package has
underwriters laboratory
111
flammability classifications
For surface mounted applications
Low profile package
Built-in strain relief,ideal for automated placement
Glass passivated chip junction
High temperature soldering:
111
250
o
C/10 seconds at terminals
S1A --- S1M
REVERSE VOLTAGE: 50 - 1000 V
CURRENT: 1.0 A
DO - 214AC(SMA)
MECHANICAL DATA
Case:JEDEC DO-214AC,molded plastic over
1111passivated
chip
Terminals:Solder Plated, solderable per MIL-STD-
1111750,
Method 2026
Polarity: Color band denotes cathode end
Weight: 0.002 ounces, 0.064 gram
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MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25
o
C ambient temperature unless otherwise specified
S1A
Device marking code
Maximum recurrent peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forw ord rectified current
V
@T
L
=110
Peak
forw
ard
surge current
@ T
L
= 110°C
V
8.3ms
single
half-sine-w ave superimposed
V
on rated load (JEDEC Method)
Maximum instantaneous forw ard voltage at 1.0A
Maximum DC reverse current
at rated DC blockjing voltage
@T
A
=25
o
C
@T
A
=125
o
C
S1B
SB
100
70
100
S1D
SD
200
140
200
S1G
SG
400
280
400
1.0
S1J
SJ
600
420
600
S1K
SK
800
560
800
S1M
UNITS
SM
1000
700
1000
V
V
V
A
SA
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
I
R
C
J
50
35
50
40.0
1.1
5.0
50.0
15
50
-55--------+175
30.0
A
V
Typical junction capacitance(NOTE
1)
Typical thermal resitance (NOTE
2)
pF
o
R
JA
C/W
o
Operating junction and storage temperature range
T
J
T
STG
NOTE: 1.Measured
at 1.0MHz and applied reverse voltage of 4.0volts
C
www.galaxycn.com
2.Thermal
resistance form junction to ambient and junction to lead P.C.B mounted on 0.27"X0.27"(7.0X7.0mm2) copper pad areas.
Document Number 0280001
BL
GALAXY ELECTRICAL
1.
BILIN [ GALAXY SEMI-CONDUCTOR HOLDINGS LIMITED ]
