MODEL 170
Custom Power Modules
CUSTOM POWER MODULES
DESCRIPTION
BI’s Custom Power Modules are designed to assemble all
of your circuit’s power components into one, easy to
manage, package. Power modules offer a low cost
method to improve the circuit density. These modules will
also reduce the assembly labor by eliminating insulating
pads and reducing the individual bolting of discreet power
semiconductors. BI offers power module designs that
FEATURES AND BENEFITS
allow the module to be soldered to the circuit board at the
same time as the other components, eliminating hand
soldering operations. Power modules allow the use of a
simpler and less expensive heat sink.
All the power components normally bolted to the heat sink
should be included in the custom module.
TYPICAL APPLICATIONS
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Low cost custom modules
Reduced circuit size
Allows simplified heat sink
Soldering technique minimizes voids
Flexible package dimensions
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Power supply subassemblies
Motor driver
Power amplifier
H-Bridge
Bridge rectifier
Ganged power FETs
PACKAGING
Package Size
Package, Typical
Package Configurations
Custom packaging from 0.3” to 4.0” on a side.
Heat sink attachment and heat transfer.
Ceramic substrate, typically copper clad to promote heat transfer.
Base with mounted components is assembled into a custom frame and encapsulated.
7
Specifications subject to change without notice.
7-13
Model 170
BITECH [ BI TECHNOLOGIES ]
