Data Sheet
Preliminary
30W 9xx nm MaxiChip High Power Laser Diode
on Passive Cu Block Cooler
BPC30C-9xx-01
The Bookham BPC30C-9xx-01 MaxiChip laser diode on
passive cooler has been designed for direct coupling into a
800µm diameter fiber providing the high brightness required for
collimated solid-state laser pumping and direct applications.
The proprietary E2 front mirror passivation process, developed
at our Zurich site, prevents Catastrophic Optical Damage (COD)
to the laser diode facet even at extremely high output powers.
The laser diode bars are mounted on an expansion matched
CuW submount onto a Cu block package providing very high
reliability in CW and pulsed (1-Hz type) applications.
Features:
• Mounted 1.25mm x 3.6mm laser diode
• Passive 1" x 1" Cu block cooler
• Small aperture (800µm emission area)
• 30W operating power
• Highly reliable single quantum well MBE structure
• Telecom grade AuSn mounting technology
• Standard wavelength at 915nm, 940nm, and 980nm
(others available on request)
• RoHS compliant
Applications:
• Collimated solid state laser pumping
• Direct applications such as material processing
• Printing
• Medical
1
BOOKHAM [ BOOKHAM, INC. ]
