3382 - 12 mm Rotary Position Sensor
Processing Information
Process Description
1. Apply solder paste to test board
(8 - 10 mil thick)
Materials
• Sn/Ag/Cu Alloy water
soluble or no clean solder
paste
• Single sided epoxy glass
(G10) (UL approved)
• PC board approx. 4x4x.06 in.
6 units/board
Convection oven
Temperature
Room temperature
Time Interval
2. Place test units onto board
3. Ramp up
4. Preheat
5. Time above liquidus
6. Peak temperature
7. Ramp down
2.5 °C ±0.5 °/second
150 °C to 190 °C
220 °C
90 ±30 seconds
60-90 seconds
260 °C +0 °/-5 °
10-20 sec. within 5 °C of peak
Room temperature
3 °C ±0.5 °C/second
300
255
220
TEMPERATURE (°C)
190
150
0
0
50
100
150
200
250
TIME (SECONDS)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
BOURNS [ BOURNS ELECTRONIC SOLUTIONS ]
