TBU
®
P500-G and P850-G Protectors
Product Dimensions
P500-Gxxx
J
B
C
E
K
K
F
J
E
N
Dim.
A
4
A
5
2
6
H
B
M
3
1
C
D
PIN 1
D
N
TOP VIEW
SIDE VIEW
K
J
BOTTOM VIEW
K
L
L
F
E
G
J
N
E
F
G
H
H H
P850-Gxxx
B
C
G
Min.
3.40
(.139)
5.90
(.232)
0.80
(.031)
0.000
(.000)
1.15
(.045)
1.05
(.041)
--
1.10
(.043)
0.375
(.015)
0.70
(.028)
--
0.70
(.028)
0.375
(.015)
P500-G
Typ.
4.00
(.157)
6.00
(.236)
0.85
(.033)
0.025
(.001)
1.25
(.049)
1.15
(.045)
--
1.20
(.047)
0.425
(.017)
0.75
(.030)
--
Max.
4.10
(.161)
6.10
(.240)
0.90
(.035)
0.050
(.002)
1.35
(.053)
1.25
(.049)
--
1.30
(.051)
0.475
(.019)
0.80
(.031)
--
E
4A
A
4
3
5
2
6
1
6A
1A
M
J
K
3A
PIN 1
D
N
L
M
N
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Pads 1A and 1 are internally connected; the same for pads 3A with 3, 4A with 4, and 6A with 6.
This allows for one PCB layout to accommodate the P500 or P850.
0.75 0.80
(.030) (.031)
0.425 0.475
(.017) (.018)
DIMENSIONS:
P850-G
Min. Typ.
3.40 4.00
(.139) (.157)
8.15 8.25
(.321) (.325)
0.80 0.85
(.031) (.033)
0.000 0.025
(.000) (.001)
1.15 1.25
(.045) (.049)
1.05 1.15
(.041) (.045)
0.725 0.825
(.029) (.032)
1.10 1.20
(.043) (.047)
0.375 0.425
(.015) (.017)
0.25 0.30
(.010) (.012)
0.70 0.75
(.028) (.030)
0.70 0.75
(.028) (.030)
0.375 0.425
(.015) (.017)
MM
(INCHES)
Max.
4.10
(.161)
8.35
(.329)
0.90
(.035)
0.050
(.002)
1.35
(.053)
1.25
(.049)
0.925
(.036)
1.30
(.051)
0.475
(.019)
0.35
(.014)
0.80
(.031)
0.80
(.031)
0.475
(.018)
Recommended Pad Layout
P500-Gxxx
1.225
(.048) 1.275
(.050)
0.75
(.030)
1.15
(.045)
0.375
(.015)
Pad Designation
Pad #
Apply
1
Tip In
2
NC
3
Tip Out
4
Ring Out
5
NC
6
Ring In
NC = Solder to PCB; do not make electrical
connection, do not connect to ground.
Block Diagram
P500-Gxxx
6
4
1
3
P850-Gxxx
1.225
(.048)
0.85
(.033)
1.25
(.049)
1.15
(.045)
0.375
(.015)
0.30
(.012)
0.75
(.030)
Pad #
1A
1
2
3
3A
Pad Designation
Apply
Pad #
Apply
Tip In
4A
Ring Out
Tip In
4
Ring Out
NC
5
NC
Tip Out
6
Ring In
Tip Out
6A
Ring In
P850-Gxxx
6 & 6A
4 & 4A
NC = Solder to PCB; do not make electrical
connection, do not connect to ground.
1 & 1A
3 & 3A
TBU
®
devices have matte-tin termination finish. Suggested layout should use non-solder mask
define (NSMD). Recommended stencil thickness is 0.10-0.12 mm (.004-.005 in.) with stencil
opening size 0.025 mm (.0010 in.) less than the device pad size. As when heat sinking any power
device, it is recommended that, wherever possible, extra PCB copper area is allowed. For mini-
mum parasitic capacitance, do not allow any signal, ground or power signals beneath any of the
pads of the device.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
BOURNS [ BOURNS ELECTRONIC SOLUTIONS ]
