BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-BEG274
●
Features:
1. Chip material: GaAsP/GaP (Hi-Eff Red)
and GaP/GaP (Green)
2. Emitted color : Hi-Eff Red and Green
3. Lens Appearance : White Diffused
4. Low power consumption.
5. High efficiency.
6. Versatile mounting on P.C. Board or panel.
7. Low current requirement.
8. 5mm diameter package.
9. This product don’t contained restriction
substance, compliance ROHS standard.
●
Package dimensions:
5.0(.197)
8.62(.339)
1.0(.039)
Green
Cathode
Hi-Eff Red
Cathode
1.5(.059)
MAX.
25.4(1.0) MIN.
0.5(.02)
SQ. TYP.
1.0(.039) MIN.
2.54(.10)NOM.
5.7(.22)
●
Applications:
1. TV set
2. Monitor
3. Telephone
4. Computer
5. Circuit board
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm (0.01”) unless otherwise specified.
3. Lead spacing is measured where the leads emerge from
the package.
4. Specifications are subject to change without notice.
●
Absolute maximum ratings(Ta=25℃)
Parameter
Power Dissipation
Forward Current
Peak Forward Current*
1
Operating Temperature
Storage Temperature
Soldering Temperature
Symbol
Pd
I
F
I
FP
Topr
Tstg
Tsol
Hi-Eff Red
80
30
150
-40
℃
~80
℃
-40
℃
~85
℃
260
℃
(for 5 seconds)
Green
80
30
150
Unit
mW
mA
mA
*
1
Condition for I
FP
is pulse of 1/10 duty and 0.1msec width.
Ver.2.0 Page: 1 of 2
BRIGHT [ BRIGHT LED ELECTRONICS CORP ]
