PRELIMINARY
CM1425
Mechanical Details
CM1425 devices are packaged in a custom Chip Scale
Packages (CSP) and available with optional Opti-
Guard
™
coating.
.
CM1425 9-bump CSP Mechanical Specifications
The CM1425 devices are packaged in a 9-bump cus-
tom Chip Scale Package (CSP). Dimensions are pre-
sented below.
BOTTOM VIEW
A1
C1
B1
B2
Mechanical Package Diagrams
Non-coated CSP
PACKAGE DIMENSIONS
Package
Bumps
Dim
A1
A2
B1
B2
C1
C2
D1
1
D2
1
D3
2
D4
2
Millimeters
Min
0.925
2.425
0.495
0.495
0.185
0.185
0.562
0.356
0.600
0.394
Nom
0.970
2.470
0.500
0.500
0.235
0.235
0.606
0.381
0.670
0.445
Max
1.015
2.515
0.505
0.505
0.285
0.285
0.650
0.406
0.739
0.495
Min
Custom CSP
9
Inches
Nom
Max
0.0364 0.0382 0.0400
0.0955 0.0972 0.0990
0.0195 0.0197 0.0199
0.0195 0.0197 0.0199
0.0073 0.0093 0.0112
0.0073 0.0093 0.0112
0.0221 0.0239 0.0256
0.0140 0.0150 0.0160
0.0236 0.0264 0.0291
0.0155 0.0175 0.0195
3500 pieces
Controlling dimension: millimeters
Note 1: Applies to uncoated devices only.
Note 2: Applies to OptiGuard (coated) devices only.
B1
5
4
3
2
1
B
A
D1
B
A
C2
A2
0.30 DIA.
D2
63/37 Sn/Pb (Eutectic) or
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
OptiGuard
™
Coated CSP
BOTTOM VIEW
A1
C1
B2
OptiGuard
TM
Coating
# per tape
and reel
5
4
3
2
1
B
A
D3
B
A
C2
A2
0.30 DIA.
D4
63/37 Sn/Pb (Eutectic) or
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions
CM1425 9-bump Chip Scale Package
© 2004 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲
Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
04/21/04
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
