CM1460
Mechanical Details (cont’d)
TDFN-12 Mechanical Specifications
Mechanical Package Diagrams
The CM1460-06DE is supplied in an 12-lead, 0.5mm
pitch TDFN package. Dimensions are presented
below.
D
For complete information on the TDFN-12, see the Cal-
ifornia Micro Devices TDFN Package Information doc-
ument.
12 11 10 9 8 7
Pin 1
Marking
PACKAGE DIMENSIONS
Package
TDFN
1 2 3 4 5 6
TOP VIEW
✝
JEDEC
No.
MO-229C
Leads
12
Millimeters
Nom
Inches
Nom
0.10
C
Dim.
Min
0.70
0.00
Max
Min
Max
A
A1
A3
b
0.75
0.80 0.028 0.030 0.031
0.05 0.000 0.001 0.002
0.008 REF
0.08
C
0.02
A1
A3
SIDE VIEW
0.20 REF
0.25
A
b
0.20
2.90
2.40
1.25
0.30
0.30 0.008 0.010 0.012
3.10 0.114 0.118 0.122
2.60 0.095 0.098 0.102
1.45 0.049 0.053 0.057
0.50 0.012 0.016 0.020
0.020 BSC
D
3.00
8X
M
0.10
C A B
e
D2
E
2.50
E2
1.35
Pin 1
1
2
3
4
5
6
7
Locator
E2
e
0.40
C0.2
GND PAD
0.50 BSC
12 11 10
9
8
K
0.20
0.20
0.008
K
L
0.25
0.30 0.008 0.010 0.012
3000 pieces
D2
L
# per
tape and
reel
BOTTOM VIEW
Controlling dimension: millimeters
✝
Dimensions for 12-Lead, 0.5mm pitch
TDFN package
This package is compliant with JEDEC standard MO-229C with the
exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as
called out in the table above.
© 2006 California Micro Devices Corp. All rights reserved.
6
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com 02/23/06