PRELIMINARY
CM1470
Mechanical Details
CM1470-06CP Mechanical Specifications
Dimensions for the CM1470-04CP supplied in a 14-
bump, 0.4mm pitch chip scale package (CSP) are pre-
sented below.
For complete information on the CSP-14, see the Cali-
fornia Micro Devices CSP Package Information docu-
ment.
B1
Mechanical Package Diagrams
OptiGuard
TM
Coated CSP
BOTTOM VIEW
A1
C1
B2
OptiGuard
TM
Coating
PACKAGE DIMENSIONS
Package
Bumps
Dim
A1
A2
B1
B2
C1
C2
D1
D2
Millimeters
Min
Nom
Max
Min
Custom CSP
14
Inches
Nom
Max
7
6
5
A2
4
3
2
1
B
A
D1
B
A
C2
B
A
0.791 0.836 0.881 0.0311 0.0329 0.0347
2.785 2.830 2.875 0.1096 0.1114 0.1132
0.395 0.400 0.405 0.0156 0.0157 0.0159
0.395 0.400 0.405 0.0156 0.0157 0.0159
0.168 0.218 0.268 0.0066 0.0086 0.0106
0.165 0.215 0.265 0.0065 0.0085 0.0104
0.537 0.607 0.676 0.0211 0.0239 0.0266
0.368 0.419 0.470 0.0145 0.0165 0.0185
3500 pieces
0.25 DIA.
D2
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
NOTE: DIMENSIONS IN MILLIMETERS
SIDE
VIEW
# per tape and
reel
Controlling dimension: millimeters
Package Dimensions for
CM1470-06CP Chip Scale Package
© 2006 California Micro Devices Corp. All rights reserved.
03/15/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
9
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
