CM3002
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
ESD Protection (HBM)
+2000
V
Pin Voltages
VCC
[GND - 0.4] to [+6.0]
[GND - 0.4] to [+6.0]
[GND - 0.4] to [+6.0]
V
V
V
EN
VOUT
Storage Temperature Range
-40 to +150
°C
Operating Temperature Range
Ambient
Junction
0 to +70
0 to +150
°C
°C
Power Dissipation (Note 1)
Internally Limited
W
Note 1: The SOIC and MSOP packages are thermally enhanced through the use of a fused integral leadframe. The power rating is
based on a printed circuit board heat spreading capability equivalent to 2 square inches of copper connected to the GND
pins. Typical multi-layer boards using power plane construction will provide this heat spreading ability without the need for
additional dedicated copper area. Please consult with factory for thermal evaluation assistance.
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
VCC (CM3002-15SA, CM3002-18SA, CM3002-25SA)
3.0 to 3.6
V
VCC (CM3002-33SA, CM3002-33MA)
3.0 to 5.5
V
Ambient Operating Temperature Range
0 to +70
0 to +1000
10 +20%
°C
mA
µF
Load Current
CEXT
© 2004 California Micro Devices Corp. All rights reserved.
08/16/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
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www.calmicro.com
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