CALIFORNIA MICRO DEVICES
CSPPT
P R I N T E D C I R C U I T B OA R D R E C O M M E N D AT I O N S
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening
Solder Flux Ratio
Solder Paste
Bond Trace Finish
0.300mm
Round
Non Solder Mask Defined Pads (NSMD)
0.350mm
0.152mm
0.360mm (sq.)
50/50
No Clean
OSP (Entek Cu Plus 106A)
Typical Solder Reflow Thermal Profile (No Clean Flux)
250
EXH
225
200
PH
Z2
Z3
Z4
Z5
RF
CD
EXH
Temperature (
o
C)
175
150
125
100
75
50
25
0
48
97
145
194
Time (s)
242
290
339
387
435
PART NUMBER KEY
CSP
PT
YY
XXX
T
PACKAGE TYPE
CSP = Chip Scale
Package
APPLICATION
Parallel Termination
Number of
Terminations
08 = 8
16 = 16
32 = 32
Resistor
Value Code
R1 Value
First 2 digits
are significant
value. 3rd digit
represents number
of zeros
Tolerance
F = ±1%
J = ±5%
© 2000 California Micro Devices Corp. All rights reserved.
11/10/2000
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
3
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
