CALIFORNIA MICRO DEVICES
CSPRC030
Chip Scale Package (CSP) EMI Filter Network
Features
• Minimal Cross-Talk
• 4 Filter lines per device
• Ultra small foot print
• Silicon substrate
• 0.35mm Eutectic Solder Bumps
Applications
• Cellular Phones
• Cordless Phones
• Internet Appliances
• PDAs
• Laptop Computers
Product Description
Many portable applications frequently demand filtering
of signals in the 800-2,700MHz band. California Micro
Devices’ unique thin film Flip Chip filters provide a
minimum of –30dB of attenuation over this frequency
band. The bump size and pitch of these filters are
selected such that the device can be placed directly on
a FR4 printed circuit board using conventional assembly
techniques. The pin-out for the device features a signal
‘flow through’ design, allowing optimal signal routing.
Ground-bounce and cross-talk are minimized via a die
design that provides two solder bump contacts to the
common supply connection. The solder bump contacts
are a 63/37 Sn/Pb alloy and are nominally 0.35 mm in
diameter.
SCHEMATIC DIAGRAM
A1
R 100Ω
C
39pF
GND
A2
R 100Ω
C
39pF
GND
A3
GND
A4
R 100Ω
C
39pF
GND
A5
R 100Ω
C
39pF
GND
B5
B4
B3
B2
B1
S TA N D A R D VA L U E S
Resi st or
Ab s o l u t e To l e r a n c e R
Capaci t or
Ab s o l u t e To l e r a n c e C
TCR of Resi st or s
Op e r a t i n g Te mp e r a t u r e Ra n g e
Leakage Cur r ent @ ±6V
Powe r Ra t i n g / Re s i s t o r
© 2000 California Micro Devices Corp. All rights reserved.
9/20/2000
E L E C T R I C A L C H A R AC T E R I S T I C S
Fi l ter
RC
R (
Ω
)
100
C( pF)
39
Fc ( Not e 1)
40MHz
Fc ( Not e 2)
109MHz
100
Ω
±10%
39pF
±20%
±100ppm
–40°C to 85°C
<1µA
25mW
* Note 1: Calculated with 0Ω Source impedance and infinite Load
impedance.
* Note 2: Calculated with 50Ω Source impedance and 50Ω Load
impedance.
C1440800
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
1
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
