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PACDN1416C 参数 Datasheet PDF下载

PACDN1416C图片预览
型号: PACDN1416C
PDF下载: 下载PDF文件 查看货源
内容描述: ESD保护阵列,芯片级封装 [ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE]
分类和应用:
文件页数/大小: 3 页 / 54 K
品牌: CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
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CALIFORNIA MICRO DEVICES
PACDN1404C
PACDN1408C
PACDN1416C
ESD Protection Arrays, Chip Scale Package
Features
• 4, 8, or 16 transient voltage suppressors in a
single package
• In-system Electrostatic Discharge (ESD)
protection to 25kV contact discharge per
IEC 61000-4-2 international standard
• Compact Chip Scale Package (0.65mm pitch) format
saves board space and eases layout in space
critical applications compared to discrete
solutions and traditional wire bonded packages
Applications
• ESD protection of I/O port connections,
such as cellular phone, PDA, internet appliance
and PC ports
• Protection of interface ports or IC pins which are
exposed to high levels of ESD
Product Description
The PACDN1404C, PACDN1408C and PACDN1416C
are transient voltage suppressor arrays that provide a
very high level of protection for sensitive electronic
components that may be subjected to ESD.
These devices are designed and characterized to safely
dissipate ESD strikes at levels well beyond the maxi-
mum requirements set forth in the IEC 61000-4-2
international standard (Level 4, 8kV contact discharge).
All I/Os are rated at 25kV using the IEC 61000-4-2
contact discharge method. Using the MIL-STD-883D
(Method 3015) specification for Human Body Model
(HBM) ESD, all pins are protected for contact discharges
to greater than 30kV.
The Chip Scale Package format of these devices enable
extremely small footprints that are necessary in portable
electronics such as cellular phones, PDAs, internet
appliances and PCs. The large solder bumps allow for
standard attachment to laminate boards without the use
of underfill.
SCHEMATIC DIAGRAMS
D1
D2
D3
D4
D5
B1
B2
B3
B1
B2
B3
B4
B5
C1
B1
C2
B2
C3
B3
C4
B4
C5
B5
A1
A2
A3
A1
A2
A3
A4
A5
PACDN1404C
PACDN1408C
A1
A2
A3
A4
A5
PACDN1416C
S TA N D A R D PA R T O R D E R I N G I N F O R M AT I O N
Package
Style
Chip Scale
Chip Scale
Chip Scale
© 2000 California Micro Devices Corp. All rights reserved.
8/4/2000
Ordering Part Number
Bumps
6
10
20
Tape & Reel
PACDN1404C/R
PACDN1408C/R
PACDN1416C/R
C1230700
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
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