MECHANICAL
Package/Pinout "Y" and "Z"
SMD PACKAGE
1.285±0.010"
(32.64±0.25)
1514 13
DIP PACKAGE
1.285±0.010"
(32.64±0.25)
2423 22
2423 22
1514 13
0.525±0.010"
(13.34±0.25)
HB01UxxyzzY
TOP VIEWS
0.525±0.010"
(13.34±0.25)
HB01UxxyzzZ
0.695±0.015"
(17.65±0.38)
1 2 3
10 11 12
1 2 3
10 11 12
0.375±0.005"
(9.52±0.13)
0.015±0.005"
(0.38±0.13)
0.020±0.002"
(0.51±0.05)
SIDE VIEWS
0.100±0.010"
(2.54±0.25)
0.375±0.005"
(9.52±0.13)
0.015±0.005"
(0.38±0.13)
0.100±0.010"
(2.54±0.25)
0.020±0.002"
(0.51±0.05)
0°-15°
0.600"
(15.24)
0.125+0.030"
-0.000"
(3.18+0.76)
(
-0.00)
END VIEWS
0.014±0.002"
(0.36±0.05)
.015±.010"
(.38±.25)
NU = Do Not Use.
NC = No Internal Connection.
Duplicate pin functions are internally connected.
All dimensions are in inches (millimeters).
GRID: 0.100 inches (2.54 millimeters)
Typically Marked with: specific model ordered, date code, job code and Logo.
MATERIAL: Units are encapsulated in a low thermal resistance molding
compound which has excellent chemical resistance, wide operating
temperature range, and good electrical properties under high humidity
environments. The encapsulant and outer shell of the unit have UL94V-0
ratings. Lead material is brass with a solder plated surface to allow ease of
solderability.
PIN CONNECTIONS
PIN#
1
2
3
10
11
12
13
14
15
21
22
23
24
SINGLES
+V
OUT
-V
OUT
NU
-V
IN
NC
+V
IN
+V
IN
NC
-V
IN
NC
NU
-V
OUT
+V
OUT
DUALS
+V
OUT
Common
-V
OUT
-V
IN
NC
+V
IN
+V
IN
NC
-V
IN
NC
-V
OUT
Common
+V
OUT
RECOMMENDED LAND PATTERN
0.100"
(2.54)
2423 22
1514 13
RECOMMENDED REFLOW PROFILE
30 sec MAX
(>220°C)
250
235 °C MAX
220
200
190
TEMPERATURE (°C)
0.730"
(18.54)
0.040"
(1.02)
1 2 3
0.080"
(2.03)
150
10 11 12
100
1.150"
(29.21)
90 sec MAX
(>190°C)
50
TIME (seconds)
HB01U 11/98 REV B
Page 3
CANDD [ C&D TECHNOLOGIES ]
