Type T495
Solid Tantalum Chip Capacitors
Capacitor Outline Drawing
Cathode (–) End
View
W
H
K
X
S
T
G
S
R
P
Notch at
Supplier’s Option
Side View
B
B
Anode (+) End
View
Bottom View
A
E
F
L
Dimensions
EIA/
CDE
D
X
IECQ
7343-31
7343-43
L
7.3 ± 0.3
(.287 ± .012)
7.3 ± 0.3
(.287 ± .012)
W
4.3 ± 0.3
(.169 ± .012)
4.3 ± 0.3
(.169 ± .012)
H
2.8 ± 0.3
(.110 ± .012)
4.0 ± 0.3
(.157 ± .012)
K
1.5 ± 0.2
(.059 ± .008)
2.3 ± 0.2
(.091 ± .008)
F
2.4 ± 0.1
(.094 ± .004)
2.4 ± 0.1
(.094 ± .004)
S
1.3 ± 0.3
(.051 ± .012)
1.3 ± 0.3
(.051 ± .012)
Millimeters (Inches)
B
(Ref)
0.5 ± 0.15
0.5 ± 0.15
X
(Ref)
0.10 ± 0.10
0.10 ± 0.10
P
(Ref)
0.9
1.7
R
(Ref)
1
1
T
(Ref)
0.13
(0.005)
0.13
(0.005)
A
(Min)
3.8
3.8
G
(Ref)
3.5
3.5**
E
(Ref)
3.5
(0.138)
3.5**
(0.138)
(.020 ± .006) (.004 ± .004)
(.020 ± .006) (.004 ± .004)
(0.035) (0.039)
(0.067) (0.039)
(0.150) (0.138)
(0.150) (0.138)
Notes:
1 Metric dimensions gover
2 (Ref) - Dimensions provided for reference onl
** Round Glue Pad 2.9 ±0.1mm (.114 ±.004) in diameter at Supplier's option
Low Profile Capacitor Dimensions
EIA/
CDE
V
IECQ
7343-20
L
7.3 ±0.3
W
4.3 ±0.3
HMax.
2.0
(0.079)
K Min.
1.1
(0.043)
F ±0.1
2.4
(0.094)
S ±0.3
1.3
(0.051)
X
(Ref)
0.05
(0.002)
T
(Ref)
0.13
(0.005)
Millimeters (Inches)
A
(Min)
3.8
(.150)
G
(Ref)
3.5
(0.138)
E
(Ref)
3.5
(0.138)
(.287 ±0.012) (.169 ±0.012)
Notes:
1 Metric dimensions gover
2 (Ref) - Dimensions provided for reference onl
3 No dimensions provided for B, P or R because low profile cases do not have a bevel or notch
Part Numbering System
T495
Se rie s
T495
D
Ca se
D
X
V
685
Ca pa cita nce
685
= 6.8 µF
226
= 22 µF
227
= 220 µF
K
Tole ra nce
K
= ±10%
M
= ±20%
035
Volta ge
006
= 6 Vdc
035
= 35 Vdc
A
Fa ilure Ra te
Le ve l
A
= Not Applicable
S
Te rmina tion
Pla ting
S
= Tin-Lead (Sn/Pb)
T
= 100% Matte Tin
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www.cde.com
CDE [ CORNELL DUBILIER ELECTRONICS ]
