PS2911-1
Recommended Soldering Conditions
(1) Infrared reflow soldering
• Peak reflow temperature
• Time of peak reflow temperature
• Time of temperature higher than 220 ˚C
• Time to preheat temperature from 120 to 180°C
• Number of reflows
• Flux
260 ˚C or below (package surface temperature)
10 seconds or less
60 seconds or less
120±30 s
Three
Rosin flux containing small amount of chlorine (The flux
with a maximum chlorine content of 0.2 Wt % is
recommended).
Recommended Temperature Profile of Infrared Reflow
Package Surface Temperature T (˚C)
(heating)
to 10 s
260 ˚C (peak temperature)
220 ˚C
to 60 s
180 ˚C
120˚C
120±30 s
(preheating)
(2) Wave soldering
• Temperature
• Time
• Preheating conditions
• Number of times
• Flux
Time (s)
260 ˚C or below (molten solder temperature)
10 seconds or less
120°C or below (package surface temperature)
One (Allowed to be dipped in solder including plastic mold portion.)
Rosin flux containing small amount of chlorine (The flux
with a maximum chlorine content of 0.2 Wt % is recommended).
(3) Cautions
• Fluxes
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature ad high humidity.
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
Avoid removing the residual flux with chlorine-based cleaning solvent after a reflow process.
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
CEL [ CALIFORNIA EASTERN LABS ]
