TYPE
CITATION
SUBJECT
SMV0402M
□□□
KRR
Soldering
MODEL
DATE
REV.
PAGE
6/9
Feb. 03, 2009
C01
☆
IR reflow Pb Free Process suggestion profile
(1) The solder recommend is Sn96.5/Ag 3.5 of 120 to 150μm
(2) Ramp-up rate (217℃ to Peak) + 3℃/second max
(3) Temp. maintain at 175 +/-25℃ 180 seconds max
(4) Temp. maintain above 217
℃
60-150 seconds
(5) Peak temperature range 245℃ +20℃/ -10
℃
time within 5
℃of
actually peak temperature (tp) 10~20
seconds
(6) Ramp down rate +6
℃/second
max.
※Perform
adequate test in advance as the reflow temperature profile will vary according to the conditions of the
manufacturing process, and the specification of the reflow furnace.
5.5 Resistance to soldering heat-High Temperature Resistance:260℃,10sec-3times.
5.6 Hand Soldering
In hand soldering of the Varistors. Large temperature gradient between preheated the Varistors and the tip of
soldering iron may cause electrical failures and mechanical damages such as crackings or breakings of the
devices. The soldering shall be carefully controlled and carried out so that the temperature gradient is kept
minimum with following recommended conditions for hand soldering.
5.6.1 Recommended Soldering Condition 1
（1）
Solder
：
0.12~0.18mm
Thread solder (Sn96.5:Ag3.5) with soldering flux in the core. Rosin-based and
non-activated flux is recommended.
（2）
Preheating
The Varistors shall be preheated so that Temperature Gradient between the devices and the tip of
soldering iron is 150
℃
or below.
CERAMATE [ CERAMATE TECHNICAL ]
