ABS2 THRU ABS10
SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIFIERS
Voltage Range - 200 to 1000 Volts
ABS
Current - 0.8/1.0 Ampere
FEATURES
Ideal for printed circuit board
Reliable low cost construction utilizing
molded plastic technique
High temperature soldering guaranteed:
260
/10
seconds at 5 lbs., (2.3kg) tension
Small size, simple installation
High surge current capability
Glass passivated chip junction
MECHANICAL DATA
Case:
Molded plastic body
Terminals:
Plated leads solderable per MIL-STD-750,
Method 2026
Polarity:
Polarity symbols marked on case
Mounting Position:
Any
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load, for capacitive load derate current by 20%.
MDD Catalog Number
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
On glass-epoxy P.C.B.(Note1)
On aluminum substrate(Note2)
Peak forward surge current,
8.3ms single half sine-wave superimposed on
rated load (JEDEC Method)
Maximum instantaneous forward voltage drop
per leg at 0.4A
Maximum DC reverse current
T
A
=25
at rated DC blocking voltage
T
A
=100
Typical thermal resistance(NOTE 3)
SYMBOLS
ABS2
200
140
200
ABS4
400
280
400
ABS6
600
420
600
0.8
1.0
30
ABS8
800
560
800
ABS10
1000
700
1000
UNITS
VOLTS
VOLTS
VOLTS
Amps
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
Amps
V
F
I
R
R
R
JL
JA
0.95
5
100
25
80
-55 to +150
-55 to +150
Volts
uA
uA
/W
Operating temperature range
storage temperature range
T
J
T
STG
NOTES:1.On glass epoxy P.C.B. mounted on 0.05x0.05''(1.3x1.3mm) pads
2.On aluminum substrate P.C.B. with on area of 0.8''x0.8''(20x20mm) mounted on 0.05X0.05''(1.3X1.3mm) solder pad
3.Thermal resistance form junction to ambient and junction to lead mounted on P.C.B. with 0.2X0.2''(5X5mm)
copper pads.
MDD ELECTRONIC
CHENDA [ Chendahang Electronics Co., Ltd ]
