CS294
Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
D
Lead Count
8 Lead PDIP
8 Lead SO Narrow
Metric
Max
Min
10.16
9.02
5.00
4.80
English
Max Min
.400 .355
.197 .189
Thermal Data
R
QJC
R
QJA
typ
typ
8 Lead
PDIP
52
100
8 Lead
SO Narrow
45
165
ûC/W
ûC/W
Plastic DIP (N); 300 mil wide
7.11 (.280)
6.10 (.240)
8.26 (.325)
7.62 (.300)
3.68 (.145)
2.92 (.115)
1.77 (.070)
1.14 (.045)
2.54 (.100) BSC
.356 (.014)
.203 (.008)
0.39 (.015)
MIN.
.558 (.022)
.356 (.014)
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
All specs are the same.
REF: JEDEC MS-001
D
Surface Mount Narrow Body (D); 150 mil wide
4.00 (.157)
3.80 (.150)
6.20 (.244)
5.80 (.228)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
1.75 (.069) MAX
1.57 (.062)
1.37 (.054)
1.27 (.050)
0.40 (.016)
0.25 (.010)
0.19 (.008)
D
REF: JEDEC MS-012
0.25 (0.10)
0.10 (.004)
Ordering Information
Part Number
CS294GN8
CS294GD8
CS294GDR8
Rev. 1/20/99
Description
8 Lead PDIP
8 Lead SO Narrow
8 Lead SO Narrow
(tape & reel)
4
Cherry Semiconductor Corporation reserves the right to
make changes to the specifications without notice. Please
contact Cherry Semiconductor Corporation for the latest
available information.
© 1999 Cherry Semiconductor Corporation
CHERRY [ CHERRY SEMICONDUCTOR CORPORATION ]
