CS8312
Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
D
Lead Count
8 Lead SO Narrow
8 Lead PDIP
Metric
Max
Min
5.00
4.80
10.16
9.02
English
Max Min
.197 .189
.400 .355
Thermal Data
R
QJC
R
QJA
typ
typ
8L SO
45
165
8L PDIP
52
100
ûC/W
ûC/W
Surface Mount Narrow Body (D); 150 mil wide
4.00 (.157)
3.80 (.150)
6.20 (.244)
5.80 (.228)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
1.75 (.069) MAX
1.57 (.062)
1.37 (.054)
1.27 (.050)
0.40 (.016)
0.25 (.010)
0.19 (.008)
D
REF: JEDEC MS-012
0.25 (0.10)
0.10 (.004)
Plastic DIP (N); 300 mil wide
7.11 (.280)
6.10 (.240)
8.26 (.325)
7.62 (.300)
3.68 (.145)
2.92 (.115)
1.77 (.070)
1.14 (.045)
2.54 (.100) BSC
.356 (.014)
.203 (.008)
0.39 (.015)
MIN.
.558 (.022)
.356 (.014)
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
All specs are the same.
REF: JEDEC MS-001
D
Ordering Information
Part Number
CS8312YN8
CS8312YD8
CS8312YDR8
Rev. 4/7/97
Description
8L PDIP
8L SO Narrow
8L SO Narrow
(tape & reel)
5
Cherry Semiconductor Corporation reserves the
right to make changes to the specifications without
notice. Please contact Cherry Semiconductor
Corporation for the latest available information.
© 1999 Cherry Semiconductor Corporation
CHERRY [ CHERRY SEMICONDUCTOR CORPORATION ]
