AB102S-A THRU AB110S-A
Single Phase 0.8AMP Surface Mount Glass Passivated Bridge Rectifiers
■ Outline
■ Features
• Glass passivated die construction.
• Low forward voltage drop.
• High current capability.
• High surge current capability.
• Design for surface mount application.
• Plastic material-UL flammability 94V-0.
-
• Suffix “G” indicates Halogen free parts, ex AB102SG-A
+
Marking code
■ Mechanical data
• Case : SOPA-4,Molded plastic, ABS
• Terminals :plated leads solderable per
MIL-STD-202, Method 208
• Polarity : as marked on case
• Mounting position: Any
• Marking: type number
■ Maximum ratings and electrical characteristics
Rating at 25OC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Parameter
Conditions
TA = 30OC (Note:1)
TA = 30OC (Note:2)
Symbol
IO
MIN.
TYP.
MAX.
0.5
UNIT
A
Average rectified output current
0.8
8.3ms single half sine-wave superimposed on
Non-Repetitive Peak
Forward surge current
IFSM
IR
30
A
rate load (JEDEC method)
TA = 25OC
TA = 125OC
5
Peak Reverse current
at rated DC blocking voltage
uA
500
62.5
25
Typical Thermal resistance
per leg (Note:3)
RθJA
RθJL
TSTG
TJ
OC/W
OC
OC
-55 to
Storage temperature
+150
+150
-55 to
Operating Junction temperature
forward voltage
per element
@IF=0.5A
VFM (V)
Max.
Max.
Max. DC
blocking voltage
VDC (V)
Max.
RMS voltage
VRMS (V)
repetitive peak Working peak
reverse voltage reverse voltage
Symbol
Marking code
VRRM (V)
VRWM (V)
AB102S-A
AB104S-A
AB106S-A
AB108S-A
AB110S-A
ABS2
ABS4
ABS6
ABS8
ABS10
200
400
200
400
200
400
140
280
420
560
700
600
600
600
0.95
800
800
800
1000
1000
1000
Note: 1.Mounted on glass epoxy PC board with 1.3mm2 solder pad.
2.Mountaed on aluminum substrate PC board with 1.3mm2 solder pad.
3.Measured at 1.0MHz and applied reverse voltage of 4.0V D.C.
Document ID : DS-22B42
Revised Date : 2017/06/23
Revision : C2
1
CITC [ Chip Integration Technology Corporation ]
