B140WG-SL THRU B1200WG-SL
1A Surface Mount Schottky Barrier Rectifiers
Chip Integration Technology Corporation
■ Features
■ Outline
SOD-123SL
• Low profile surface mounted application in order to
optimize board space.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• Ultra high-speed switching.
0.150(3.80)
0.134(3.40)
• Silicon epitaxial planar chip, metal silicon junction.
• Lead free in compliance with EU RoHS.
0.051(1.3)
0.032(0.8)
0.079(2.0)
0.059(1.5)
Marking code
0.008(0.20)
0.004(0.10)
■ Mechanical data
0.043(1.10)
0.033(0.85)
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123SL
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
0.037(0.95)
0.022(0.55)
• Polarity : Indicated by cathode band
• Weight : Approximated 0.018 gram
Dimensions in inches and (millimeters)
■ Maximum ratings and electrical characteristics
Rating at 25OC ambient temperature unless otherwise specified.
Parameter
Conditions
Symbol
IO
MIN.
TYP.
MAX.
1.0
UNIT
A
Forward Rectified Output Current
8.3ms single half sine-wave superimposed on
rate load (JEDEC method)
Forward Surge Current
IFSM
25
A
40V,60V
0.1
0.05
10
Peak Reverse Current @ 25oC
IR
100V,150V,200V
40V,60V
mA
OC
At Rated DC Blocking Voltage @ 100oC
Storage temperature Range
IR
100V,150V,200V
5
TSTG
-50
+150
Max.
Max. forward voltage
@1A, TA = 25OC
VF (V)
Max.
RMS voltage
VRMS (V)
Max. DC
blocking voltage
VR (V)
repetitive peak
Operating temperature
TJ (OC)
Symbol
reverse voltage
VRRM (V)
B140WG-SL
B160WG-SL
B1100WG-SL
B1150WG-SL
B1200WG-SL
40
60
28
42
40
60
0.55
0.70
0.85
-50 ~ +150
100
150
200
70
100
150
200
105
140
0.92
Document ID : DS-22K020
Revised Date : 2016/12
Revision : C1
1
CITC [ Chip Integration Technology Corporation ]
