BGP4001W-F THRU BGP4007W-F
1A Surface Mount General Purpose Rectifiers
■ Features
■ Outline
• Low profile surface mounted application in order to
optimize board space.
SOD-123F
• High current capability.
• High surge capability.
0.154(3.9)
0.138(3.5)
• Glass passivated chip junction inside.
• Suffix "G" indicates Halogen-free part, ex.BGP4001WG-F.
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
0.012(0.3) Typ.
0.071(1.8)
0.055(1.4)
Marking code
■ Mechanical data
0.067(1.7)
0.051(1.3)
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123F
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
0.028(0.7) Typ.
0.028(0.7) Typ.
• Polarity : Indicated by cathode band
• Weight : Approximated 0.018 gram
Dimensions in inches and (millimeters)
■ Maximum ratings and electrical characteristics
Rating at 25OC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Parameter
Conditions
Symbol
IO
MIN.
TYP.
MAX.
1.0
UNIT
A
Forward rectified current
8.3ms single half sine-wave superimposed on
rate load (JEDEC method)
Forward surge current
IFSM
30
A
VR = VRRM TA = 25OC
VR = VRRM TA = 125OC
5.0
IR
Reverse current
uA
100
OC/W
pF
OC
Thermal resistance
Junction to ambient
RθJA
CJ
60
15
Diode junction capacitance
Storage temperature
f=1MHz and applied 4V DC reverse voltage
TSTG
-55
+150
Max.
Max.
Max.
RMS voltage
VRMS (V)
Max. DC
blocking voltage
VR (V)
forward voltage
@1.0A, TA = 25OC
VF (V)
Operating Junction
temperature TJ (OC)
repetitive peak
reverse voltage
VRRM (V)
Symbol
Marking code
BGP4001W-F
BGP4002W-F
BGP4003W-F
BGP4004W-F
BGP4005W-F
BGP4006W-F
BGP4007W-F
A1
A2
A3
A4
A5
A6
A7
50
100
200
400
600
800
1000
35
50
100
200
400
600
800
1000
70
140
280
420
560
700
1.10
-55 ~ +150
Document ID : DS-22G03
Revised Date : 2016/12
Revision : C1
1
CITC [ Chip Integration Technology Corporation ]
