CS30L60CTG-A
30A Low Barrier Diode
Main Product Characteristics
■ Outline
TO-220AB
IF(AV)
VRRM
TJ
2x15A
60V
150OC
0.419(10.66)
0.387(9.85 )
0.196(5.00)
0.163(4.16)
0.054(1.39)
0.045(1.15)
0.58V
Vfmax)
■ Features
0.269(6.85)
0.226(5.75)
• Low forward voltage drop.
• Excellent high temperature stability.
• Fast switching capability.
0.624(15.87)
0.548(13.93)
0.139(3.55 )
MIN
• Halogen-free part
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
0.177(4.50) MAX
0.038(0.96)
0.019(0.50)
0.50(12.70) MIN
0.025(0.65) MAX
■ Mechanical data
• Epoxy : UL94-V0 rated flame retardant.
• Case : JEDEC TO-220AB molded plastic body.
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026.
• Polarity: As marked.
• Mounting Position : Any.
0.1(2.54)
PIN 1
PIN 3
PIN 2
• Weight : Approximated 2.25 gram.
■ Maximum ratings and electrical characteristics
Rating at 25OC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Parameter
Marking code
Conditions
Symbol
CS30L60CTG-A
CS30L60CT
UNIT
V
Peak repetitive reverse voltage
Working peak reverse voltage
DC blocking voltage
VRRM
VRWM
VRM
IO
60
TC = 110OC
Forward rectified current (total device)
30
A
A
8.3ms single half sine-wave superimposed on
rate load (JEDEC method)
Forward surge current (per diode)
IFSM
280
OC/W
OC
RθJC
Thermal resistance(1) (per diode)
Operating and Storage temperature
Junction to case
2
TJ, TSTG
-65 ~ +150
Parameter
Conditions
IF = 15A, TJ = 25OC
IF = 15A, TJ = 125OC
VR = VRRM TJ = 25OC
VR = VRRM TJ = 125OC
Symbol
VF
MIN.
TYP.
MAX.
UNIT
mV
600
550
0.5
60
Forward voltage drop (per diode)
IR
Reverse current (per diode)
mA
Note : 1.Thermal resistance from junction to case per leg, with heatsink size(1.35" x 0.95" x 0.18") Al-plate.
Document ID : DS-11KHB
Revised Date : 2015/08/03
Revision : C
1