SK54MAFG THRU SK520MAFG
5A Surface Mount Schottky Barrier Rectifiers
Chip Integration Technology Corporation
■ Features
■ Outline
SMAF
• Low profile surface mounted application in order to
optimize board space.
0.189(4.8)
0.173(4.4)
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Lead free in compliance with EU RoHS.
0.056(1.43)
0.054(1.38)
0.110(2.8)
0.095(2.4)
Marking code
0.141(3.6)
0.126(3.2)
0.043(1.1)
0.035(0.9)
■ Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, SMAF
0.008(0.2)
0.004(0.1)
0.035 (0.9) Typ.
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Weight : Approximated 0.027 gram
Dimensions in inches and (millimeters)
■ Maximum ratings and electrical characteristics
Rating at 25OC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Parameter
Average Rectified Output Current @ 90OC
Conditions
Symbol
IO
MIN.
TYP.
MAX.
5.0
UNIT
A
8.3ms single half sine-wave superimposed on
rate load (JEDEC method)
Forward surge current
IFSM
100
A
40V,60V
0.1
0.05
10
Peak Reverse current @ 25OC
IR
mA
100V,150V,200V
40V,60V
At Rated DC Blocking Voltage @ 100OC
IR
mA
100V,150V,200V
5
CJ
Typical Junction capacitance
Typical Thermal Resistance per leg
Storage temperature
28
88
pF
OC/W
OC
RθJL
TSTG
-55
+150
Max.
Max. forward voltage
@5A, TA = 25OC
VF (V)
Max.
RMS voltage
VRMS (V)
Max. DC
blocking voltage
VR (V)
repetitive peak
Operating temperature
TJ (OC)
Symbol
reverse voltage
VRRM (V)
SK54MAFG
SK56MAFG
SK510MAFG
SK515MAFG
SK520MAFG
40
60
28
42
40
60
0.55
0.70
0.85
100
150
200
70
100
150
200
-55 ~ +150
105
140
0.92
Document ID : DS-22K019
Revised Date : 2016/08/23
Revision : C
1
CITC [ Chip Integration Technology Corporation ]
