SKL12A THRU SKL120A
1A Surface Mount Schottky Barrier Rectifiers
■ Features
■ Outline
• Low profile surface mounted application in order to
optimize board space.
SMA(DO-214AC)
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Suffix "G" indicates Halogen-free part, ex.SKL12AG.
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
0.067 (1.70 )
0.047 (1.20 )
0.114 (2.90 )
0.08 3 (2.10)
Marking code
0.18 1 (4.60)
0.15 7 (4.00)
0.012 (0.3 0)
TYP.
0.09 8 (2.50)
0.06 7 (1.70)
■ Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, DO-214AC / SMA
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
0.008 (0.2 0)
0.004 (0.1 0)
0.061 (1.55 )
0.030 (0.75 )
0.224 (5.70 )
0.185 (4.70 )
• Polarity : Indicated by cathode band
• Weight : 0.002 ounce, 0.055 gram
Dimensions in inches and (millimeters)
■ Maximum ratings and electrical characteristics
Rating at 25OC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Parameter
Conditions
Symbol
IO
MIN.
TYP.
MAX.
1.0
UNIT
A
Forward rectified current
See Fig.1
8.3ms single half sine-wave superimposed on
rate load (JEDEC method)
Forward surge current
IFSM
50
A
VR = VRRM TA = 25OC
VR = VRRM TA = 100OC
0.5
20
IR
Reverse current
mA
CJ
Diode junction capacitance
Thermal resistance
f=1MHz and applied 4V DC reverse voltage
Junction to ambient
120
88
pF
OC/W
OC
RθJA
TSTG
Storage temperature
-55
+175
Max.
Max. forward voltage
@1A, TA = 25OC
VF (V)
Max.
RMS voltage
VRMS (V)
Max. DC
blocking voltage
VR (V)
repetitive peak
reverse voltage
VRRM (V)
Operating temperature
TJ (OC)
Symbol
Marking code
SKL12A
SKL14A
SKL16A
SKL110A
SKL115A
SKL120A
KL12
KL14
20
40
14
28
20
40
0.40
0.45
0.55
0.75
0.82
0.85
-55 ~ +150
-55 ~ +175
KL16
60
42
60
KL110
KL115
KL120
100
150
200
70
100
150
200
105
140
Document ID : DS-12K11
Issued Date : 2010/05/05
Revised Date : 2012/05/31
Revision : C1
1