SKL32C THRU SKL320C
3A Surface Mount Schottky Barrier Rectifiers
■ Features
■ Outline
• Low profile surface mounted application in order to
optimize board space.
SMC(DO-214AB)
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Suffix "G" indicates Halogen-free part, ex.SKL32CG.
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
0.126 (3.20 )
0.114 (2.86 )
0.24 5 (6.22)
0.22 0 (5.59)
Marking code
0.28 0 (7.11)
0.26 0 (6.52)
0.019 (0.4 85)
MAX.
0.114 (2.90 )
0.07 5 (1.90)
■ Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, DO-214AB / SMC
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
0.008 (0.2 0)
0.004 (0.1 0)
0.063 (1.60 )
0.030 (0.76 )
0.325 (8.25 )
0.305 (7.64 )
• Polarity : Indicated by cathode band
• Weight : 0.007 ounce, 0.226 gram
Dimensions in inches and (millimeters)
■ Maximum ratings and electrical characteristics
Rating at 25OC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Parameter
Conditions
Symbol
IO
MIN.
TYP.
MAX.
3.0
UNIT
A
Forward rectified current
See Fig.1
8.3ms single half sine-wave superimposed on
rate load (JEDEC method)
Forward surge current
IFSM
125
A
VR = VRRM TA = 25OC
VR = VRRM TA = 100OC
0.5
20
IR
Reverse current
mA
CJ
Diode junction capacitance
Thermal resistance
f=1MHz and applied 4V DC reverse voltage
Junction to ambient
250
55
pF
OC/W
OC
RθJA
TSTG
Storage temperature
-55
+175
Max.
Max. forward voltage
@3A, TA = 25OC
VF (V)
Max.
RMS voltage
VRMS (V)
Max. DC
blocking voltage
VR (V)
repetitive peak
reverse voltage
VRRM (V)
Operating temperature
TJ (OC)
Symbol
Marking code
SKL32C
SKL34C
SKL36C
SKL310C
SKL315C
SKL320C
KL32
KL34
20
40
14
28
20
40
0.40
0.45
0.55
0.75
0.82
0.85
-55 ~ +150
-55 ~ +175
KL36
60
42
60
KL310
KL315
KL320
100
150
200
70
100
150
200
105
140
Document ID : DS-12K18
Issued Date : 2010/05/05
Revised Date : 2012/05/31
Revision : C1
1
CITC [ Chip Integration Technology Corporation ]
