DATA SHEET
5. Characteristic
・Forward
Current vs. Relative Luminous Intensity
Relative Luminous Intensity
[a.u.]
150%
125%
100%
V
F
[V]
75%
50%
25%
0%
0
20
40
60
I
F
[mA]
80
100
Ts=25C
4 / 12
・Forward
Current vs. Forward Voltage
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
20
40
60
I
F
[mA]
Ts=25C
80
100
・Solder
Temperature vs. Relative Luminous Intensity
・Solder
Temperature vs. Forward Voltage
120%
Relative Luminous Intensity
[a.u.]
100%
80%
60%
40%
20%
0%
0
20
40
60
80
100
120
I
F
=60mA
4.0
3.5
3.0
V
F
[V]
2.5
2.0
1.5
1.0
0.5
0.0
I
F
=60mA
Ts [C]
0
20
40
Ts [C]
60
80
100
120
・Solder
Temperature vs. Allowable Forward Current
100
80
I
F
[mA]
60
40
20
0
0
20
40
60
80
93
Ts [C]
100
120
<Condition>
Chip on board
board size:100mm×40mm
Materials:FR-4
Thickness of Copper:18um
Symbol
Name
CITIZEN ELECTRONICS CO.,LTD. JAPAN
Ref.CE-P1399 08/11
CL-L270-MU1WW1-A1
CITILED
CITIZEN [ CITIZEN ELECTRONICS CO., LTD. ]
