DATA SHEET
9. Precautions
9-1. Soldering
(1) Lead free soldering
1) Following soldering paste is recommended
Melting temperature: 216 ~ 220 C.
Composition: Sn / 3.5Ag / 0.75Cu
9 / 12
2) The temperature profile at the top surface of the parts is recommended as shown
below.
3) It is requested that products should be handled after their temperature has dropped
down to the normal room temperature
4
°C
/sec. Max
4
°C
/sec. Max
260
°C
Max
3
sec
. Max
220
°C
T em p era tu re
160
~
180
°C
140sec
60
~
70sec
Time
9-2. Washing
(1) When washing after soldering is needed, following conditions are requested.
a) Washing solvent: Pure Water
b) Temperature, time: 50 C or less × 30 seconds max.
or 30 C or less × 3 minutes max.
c) Ultrasonic washing: 300W or less
9-3. Other directions
(1) It is requested to avoid any stress added to the resin portion while it is heated.
(2) It is requested to avoid any friction by sharp metal nail etc. to the resin portion.
(3) For outdoor use, necessary measures should be taken to prevent water,
moisture and salt air damage.
This product is NOT designed with following conditions in mind.
In water, oil, medicament, organic solvent and dust-laden environment.
Symbol
Name
CITIZEN ELECTRONICS CO.,LTD. JAPAN
Ref.CE-P1401 08/11
CL-L270-MU1L2-A1
CITILED
CITIZEN [ CITIZEN ELECTRONICS CO., LTD. ]
